Substrate Startup Develops Less Complex and Cheaper Way to Etch Computer Chips

To prepare for a workshop next week I have been reading a lot about Stuart Kauffman and Roger Koppl’s theory of the adjacent possible (TAP), as it is applied to the growth of technology. One of the implications of TAP is the that new technology gets progressively more complex, in the sense of using an ever larger number of components. I think that is often true but I can think of a couple of counter-examples. So I was interested to read yesterday that the production of computer chips may provide another counter-example.

(p. B1) In March [2025], James Proud, an unassuming British-born American without a college degree, sat in Vice President JD Vance’s office and explained how his Silicon Valley start-up, Substrate, had developed an alternative manufacturing process for semiconductors, one of the most fundamental and difficult challenges in tech.

For the past decade, semiconductors have been manufactured by a school-bus-size machine that uses light to etch patterns onto silicon wafers inside sterile, $25 billion factories. The machine, from the Dutch company ASML, is so critical to the chips in smartphones, A.I. systems and weaponry that Washington has effectively blocked sales of it to China.

But Mr. Proud said his company, which has received more than $100 million from investors, had developed a solution that would cut the manufacturing cost in half by channeling light from a giant instrument known as a particle accelerator through a tool the size of a car. The technique had allowed Substrate to print a high-resolution microchip layer comparable to images produced by the world’s leading semiconductor plants.

. . .

(p. B4) Mr. Proud moved to San Francisco from London in 2011 as a member of the first Thiel Fellowship class, a college alternative for aspiring founders created by Peter Thiel, the venture capitalist.

. . .

After the Trump administration persuaded TSMC to build a plant in Arizona, Mr. Proud decided to build his own company. He and his brother Oliver, 25, started reading books and academic papers on semiconductor lithography. They questioned why the process had become so complex and expensive.

One of the major costs in modern lithography machines, which have more than 100,000 parts, is how they use high-powered lasers to turn droplets of molten tin into a burst of extreme ultraviolet light. The machines use the light to etch a wafer of silicon in a process known as EUV lithography.

. . .

The team spent much of 2023 building a custom lithography tool. It featured thousands of parts and was small enough to fit in the back of a U-Haul. They tested it in computer simulations.

In early 2024, Substrate reserved a Bay Area particle accelerator for a make-or-break test. The company ran into problems when vibrations near the particle accelerator caused the tool to gyrate and blur the image, Mr. Proud said.

A frantic, daylong search found that the air-conditioning system was causing the vibration. Substrate adjusted the fan speed until the process printed “very beautiful and tiny things repeatedly” on a silicon wafer, Mr. Proud said.

For the full story see:

Tripp Mickle and Mike Kai Chen. “A Less Costly Route To Computer Chips?” The New York Times (Weds., Oct. 29, 2025): B1 & B4.

(Note: ellipses, and bracketed year, added.)

(Note: the online version of the story has the date Oct. 28, 2025, and has the title “Can a Start-Up Make Computer Chips Cheaper Than the Industry’s Giants?”)

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